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*;Circuit board tin plating 

=== General description ===

Example flowsheet:



[[Image: Plating tin and alloy in printed circuit board.jpg]]

Literature: Bat for the surface treatment of metals & plastics, 2006
 


=== Typical process parameters ===

{| border="1"
| align="center" style="background:#2266CC;"|'''Process'''
| align="center" style="background:#2266CC;"|'''Temperature [°C]'''
| align="center" style="background:#2266CC;"|'''Heat transfer medium'''
| align="center" style="background:#2266CC;"|'''Residence time'''
| align="center" style="background:#2266CC;"|'''Details'''
| align="center" style="background:#2266CC;"|'''Literature'''
|-
| style="background:#AACCEE;"| chemical coating || align="center"| 20-45 °C|| align="center"| water and chemicals || align="center"| continious || align=”center”|  || rowspan="3" align="center"| Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.
|-
| style="background:#AACCEE;"| zinc alloy || align="center"| >180 °C|| align="center"| zinc || align="center"| continious || align=”center”|
|-
| style="background:#AACCEE;"| purification || align="center"| up to 70 °C|| align="center"| acid or alkaline solution || align="center"| continious || align=”center”|
|}


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