Plating tin and alloy in printed circuit boards

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  • Circuit board tin plating

General description

Example flowsheet:


Plating tin and alloy in printed circuit board.jpg

Literature: Bat for the surface treatment of metals & plastics, 2006


Typical process parameters

Process Temperature [°C] Heat transfer medium Residence time Details Literature
chemical coating 20-45 °C water and chemicals continious Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.
zinc alloy >180 °C zinc continious
purification up to 70 °C acid or alkaline solution continious


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