Plating tin and alloy in printed circuit boards: Difference between revisions
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*;Circuit board tin plating | *;Circuit board tin plating | ||
=== General description === | |||
Example flowsheet: | Example flowsheet: | ||
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Literature: Bat for the surface treatment of metals & plastics, 2006 | Literature: Bat for the surface treatment of metals & plastics, 2006 | ||
=== Typical process parameters === | |||
{| border="1" | |||
| align="center" style="background:#2266CC;"|'''Process''' | |||
| align="center" style="background:#2266CC;"|'''Temperature [°C]''' | |||
| align="center" style="background:#2266CC;"|'''Heat transfer medium''' | |||
| align="center" style="background:#2266CC;"|'''Residence time''' | |||
| align="center" style="background:#2266CC;"|'''Details''' | |||
| align="center" style="background:#2266CC;"|'''Literature''' | |||
|- | |||
| style="background:#AACCEE;"| chemical coating || align="center"| 20-45 °C|| align="center"| water and chemicals || align="center"| continious || align=”center”| || rowspan="3" align="center"| Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. | |||
|- | |||
| style="background:#AACCEE;"| zinc alloy || align="center"| >180 °C|| align="center"| zinc || align="center"| continious || align=”center”| | |||
|- | |||
| style="background:#AACCEE;"| purification || align="center"| up to 70 °C|| align="center"| acid or alkaline solution || align="center"| continious || align=”center”| | |||
|} | |||
Back to [[Subsection DJ metals|EFFICIENCY FINDER FOR METAL INDUSTRY]] | Back to [[Subsection DJ metals|EFFICIENCY FINDER FOR METAL INDUSTRY]] | ||
Latest revision as of 12:06, 1 September 2016
Back to EFFICIENCY FINDER FOR METAL INDUSTRY
- Circuit board tin plating
General description
Example flowsheet:
Literature: Bat for the surface treatment of metals & plastics, 2006
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| chemical coating | 20-45 °C | water and chemicals | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. | |
| zinc alloy | >180 °C | zinc | continious | ||
| purification | up to 70 °C | acid or alkaline solution | continious |
