Drying of printed circuit boards
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- Drying of printed circuit boards
Example flowsheet:
Literature: BAT for the surface treatment of metals & plastics, 2006
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| Drying of solder mask | up to 50 °C | air | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
