Etching and descalling of printed circuit board
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- Circuit board etching
Example flowsheet:
Literature: Bat for the surface treatment of metals & plastics, 2006
- Typical parameters of the process
| Process | Temperature [°C] | Residence time | Chemicals | Details | Literature |
| PCB etching | 20-45°C | Copper: 145-170 g/l, halide: 235-265 g/l, content of chloride: 4-4,5 mol/l | pH: 8-9,5 | ||
| PCB etching | 50-80°C | water and chemicals | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
