Pickling of printed circuit boards
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Typical process parameters
Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
Pickling | 45 °C | water and chemicals | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |